Featuring Associate Professor Jeehwan Kim, Massachusets Institute of Technology
Abstract: The need for flexibility and stackability has substantially grown for the future of bioelectronics, 3D integrated electronics, and bendable electronics. However, conventional wafer-based single-crystalline semiconductors cannot catch up with such trends because they are bound to the thick rigid wafers that are neither flexible nor stackable. Although polymer-based organic electronic materials are more compatible as they are mechanically complaint and less costly than inorganic counterparts, their electronic/photonic performance is substantially inferior to that of single-crystalline inorganic materials. For the past five years, my research group at MIT has focused on mitigating this performance-mechanical compliance dilemma by developing methods to obtain cheap, flexible, stackable, single-crystalline inorganic systems. In this talk, I will discuss our strategies to realize such a dream electronic system [1-5] and how these strategies unlock new ways of manufacturing advanced electronic systems [6-10]. I will highlight our remote epitaxy technique that can produce single-crystalline freestanding membranes from compound materials with their excellent semiconducting performance. In addition, I will present unprecedented flexible/stackable systems enabled by stacking of those freestanding 3D material membranes, e.g., world’s smallest vertically-stacked full color micro-LEDs , world’s best multiferroic devices , battery-less wireless e-skin [9,11], and reconfigurable hetero-integrated chips with AI accelerators [8,12].
References:  Nature 544, 340 (2017),  Nature Materials 17, 999 (2018),  Nature Materials 18, 550 (2019),  Nature Nanotechnology 15, 272-276 (2020),  Science 362, 665 (2018),  Nature Electronics, 2, 439 (2019),  Nature, 578, 75 (2020),  Nature Nanotechnology 15, 574 (2020),  Science Advances, 7, 27 (2021)  Nature (2023) in print,  Science 377, 859 (2022),  Nature Electronics, 5, 386 (2022)
Bio: Jeehwan Kim is a tenured faculty member at MIT. His research group’s focuses on material innovations for next generation computing and electronics. Kim joined MIT in September 2015. Before joining MIT, he was a Research Staff Member at IBM T.J. Watson Research Center in Yorktown Heights, NY since 2008 right after his Ph.D. He worked on next generation CMOS and energy materials/devices at IBM. Kim is a recipient of 20 IBM high value invention achievement awards. In 2012, he was appointed a “Master Inventor” of IBM in recognition of his active intellectual property generation and commercialization of his research. After joining MIT, he continuously worked in nanotechnology for advanced electronics/photonics. He has received the LAM Research foundation Award, IBM Faculty Award, DARPA Young Faculty Award, and DARPA Director’s Fellowship. He is an inventor of more than 200 issued/pending U.S. patents and an author of more than 50 articles in peer-reviewed journals. He currently serves as Associate Editor of Science Advances and AAAS. He received a B.S. from Hongik University, an M.S. from Seoul National University, and a Ph.D. from UCLA. All of his degrees are in Materials Science.
This lecture is hosted by the IEN Center for Human-Centric Interfaces and Engineering